EMCORE’s world-class Indium Phosphide (InP) semiconductor wafer fabrication facility supports our vertically-integrated chip level devices manufacturing for our laser, transmitter and receiver products, as well as 2.5 Gbps to 25 Gbps Telecom and Datacom devices.

With class 1,000 clean room space, it features 2” and 3” wafer processes for InP-based devices including Lasers, APD & PIN Photodetectors, High Power Gain Chips and MZ Modulators. Our strong, highly-experienced technical team has expertise in device design, characterization, epitaxial growth, wafer processing, reliability and COB/TO/OSA sub-assembly for both development and manufacturing.