With class 1,000 clean room space, it features 2” and 3” wafer processes for InP-based devices including Lasers, APD & PIN Photodetectors, High Power Gain Chips and MZ Modulators. Our strong, highly-experienced technical team has expertise in device design, characterization, epitaxial growth, wafer processing, reliability and COB/TO/OSA sub-assembly for both development and manufacturing.