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The high-speed data center and telecommunications markets continue to grow to meet the constant demand for higher-speed networks. The market is being driven by the increasing number of connected devices tapping data centers and telecom networks worldwide.

This continues to fuel intense competition to increase the speed and bandwidth of data center and telecommunications networks at an accelerated rate. In the data center, growing demand for cloud services and bandwidth overall has led to the increase in deployment of fiber optics in datacom networks. Data centers are expected to require higher data rates of 800 Gbps or even 1.6 Tbps in the future. Significantly, large demand for transceivers is expected annually.

In recent years we have seen the industry benchmark for telecommunications data-rate transmission over fiber optic networks increase to 400 Gbps DWDM transport systems. The engines for these ultra-high-speed networks are tunable laser modules and transceivers deployed in line cards and coherent optical transport platforms designed by the major telecommunications network equipment suppliers.

EMCORE, through its world-class Indium Phosphide (InP) wafer fabrication facility, has extensive experience in the design and engineering of ultra-narrow linewidth laser technology for tunable lasers and transceivers used in the coherent transmission systems driving the industry‚Äôs expansion today. In addition, EMCORE’s Specialty Data Center & Telecom Chips program provides design and manufacturing services for custom chip devices tailored to specific customer requirements and applications including High-Power Gain Chips and MZ Modulators, Semiconductor Optical Amplifiers (SOA), and Laser, APD & PIN Photodetector chips.

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